- Scope of Responsibilities
1. Responsible for heat transfer simulation and design of electronic products, and participate in product development;
2. Independently carry out heat dissipation, heat conduction and heat insulation design of electronic equipment;
3. Propose feasible solutions for the heat dissipation, heat insulation and other problems existing in the product;
4. Responsible for thermal design process construction, reasonable embedded R&D process;
5. Responsible for the construction of the department's thermal design simulation capability, the construction of the department's thermal simulation database, and the improvement of thermal simulation accuracy.
- Qualifications
1. Bachelor degree or above, 1 years or above work experience, proficient in numerical simulation of thermal engineering;
2. Familiar with 3D design simulation process and methods, master heat transfer theory, and be proficient in at least one simulation software and 3D design software;
3. Numerical simulation of flow heat transfer and multiphase flow is available;
4. Experience in ultra-high temperature materials and ultra-high temperature air thermal fluid solutions is preferred;
5. Experience in cooling system design, experience in multiple scenarios such as air cooling and liquid cooling is preferred.